BMG GmbH & Co. KG - Keithstrasse 2-4 - D-10787 Berlin | Tel: +49 (0)30 2100220

PDB 49

Construction Project
Wacker Production Building for 300-mm Silicon Wafers
Location
  • Freiberg in Saxony
Client
  • Wacker Siltronic AG
Planning
  • IFB Dr. Braschel AG, Stuttgart
Investment volume
  • approx. EUR 125.0 million
Construction period
  • January 2003 to July 2004
Contracted services for BMG
  • Section 15.8-HOAI–Property planning for buildings, property supervision
Lot area
  • 40,000 m²
Footprint
  • 9,000 m² Factory building
  • 2,300 m² Central utilities and disposal
Gross floor space
  • 36,000 m² Factory building
  • 4,600 m² Central utilities and disposal
Gross volume
  • 186,000 m³ Factory building
  • 25,000 m³ Central utilities and disposal
Storeys
  • Factory building 3 in part 4 storeys
  • Central utilities and disposal 2 storeys
Utilization
  • Starting in June 2004, the production building will be used for the manufacture of 300-mm silicon wafers for further use in the chip industry. Initially, the company plans to produce up to 60,000 of the so-called large wafers every month.
Construction
  • Solid structure construction
  • Suspended facade
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